Used DISCO DFD 640 #9384370 for sale

DISCO DFD 640 is a scribing/dicing equipment which is used to accurately cut and divide wafers into individual chips. This system is commonly used in the fabrication of semiconductor components and is highly reliable for achieving desired shapes and sizes. The unit works by using a diamond-coated blade which is pressed onto the surface of the wafer with a constant pressure. The blade's diamond coating helps to reduce chipping, cracking and potential breakage of the material. It is precision engineered to within very slight tolerances, and in combination with a high-relief cutting surface, allows for maximum accuracy. DISCO DFD640 comes with two different blade sizes for finer or coarser results, depending on the specific requirement of the job. The machine is equipped with a rapid centering mechanism, allowing the operator to accurately locate the cutting site in a very short space of time. In addition, it is fitted with both an upper and a lower work surface which can be adjusted with an array of cutting height settings. Furthermore, the use of a digital pressure control technology ensures that the correct pressure is maintained from the blade throughout the entire cutting process. This ensures that there is minimal damage to the wafer in order to achieve the desired cut. DFD 640 is also equipped with a built-in software tool that can be used to create individual part shapes and sizes, or to create patterns that can then be replicated in the cutting process. This allows for greater customisation of the cutting process, while also reducing man-hours and cutting costs in the long run. Overall, DFD640 is an efficient asset which is highly reliable in achieving desired shapes and sizes, while also reducing both man hours and cost expenses with its built in software model. It is an ideal equipment for those in the semiconductor industry who need accuracy and precision in their cutting and dicing processes.