Used DISCO DFD 640 #9384372 for sale

DISCO DFD 640
Manufacturer
DISCO
Model
DFD 640
ID: 9384372
Vintage: 1997
Dicing saw 1997 vintage.
DISCO DFD 640 is a scribing/dicing equipment developed by DISCO Corporation, a Japanese firm specializing in semiconductor manufacturing equipment. This system combines a wafer slicing technique and an innovative process called "DFD" (discrete fine-dicing) to achieve high precision slicing of wafers and substrates into individual dies or rough parts. The unit is capable of cutting up to 95um of silicon, 200mm wafers and substrates up to 300mm in diameter. The machine is equipped with a unique diamond dicing blade which is highly efficient and requires minimal maintenance. This blade uses an abrasive diamond edge to scribe each wafer with a sharp, clean cut, followed by a second diamond dicing blade which breaks up the wafer into individual dies. The tool is also fitted with a double-sided adhesive asset which allows for adhesion of the substrate to the dicing blade to facilitate movement of the blade and allow for a uniform dicing. This model is designed for high accuracy and high speed. The cutting performance is enhanced by an optimized diamond scriber and a feedback monitor for controlling pulse width and pulse rate. The equipment utilizes an EPC control unit which allows for controlling of the x, y, and z axes of the dicing head. The EPC controller also monitors the speed and torque of the dicing process and provides a warning if any of those parameters exceed a predetermined value. In addition to its dicing capabilities, the system also offers the ability to align and grind compatible substrates using a high-precision, automated 3-axis grinding unit. This helps to ensure the accuracy of the dicing process as it reduces any effects that may be caused by any misalignment of the substrate. The grinding unit also provides flexibility, allowing for operation on a variety of substrates with various thicknesses. DISCO DFD640 provides a variety of features and benefits to facilitate the dicing process. Its high accuracy and high speed capabilities in combination with its ability to cut up to 95um of silicon, 200mm wafers and substrates up to 300mm in diameter make it a preferred choice for semiconductor manufacturers. Furthermore, its automated grinding unit and EPC control unit ensure that the unit offers high precision slicing for a wide variety of substrates.
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