Used DISCO DFD 640 #9400958 for sale

DISCO DFD 640 is a scribing/dicing equipment designed for automated dicing of thin, uniform samples. It is used to cut samples of materials such as glass, semiconductor wafers, quartz, and hard metals into various desired sizes and shapes. The system boasts a high-speed dicing rate and determines both accuracy and repeatability in high precision. DISCO DFD640 is constructed of durable anodized aluminum and features an integrated scribing and plunge-dicing head. This allows the machine to easily and accurately cut thin, thin-film samples, such as semiconductor wafers. The unit utilizes circular diamond scribes and abrasion jets to achieve its high-speed performance of up to 15,000 rpm. The circular design of the scribes allows for a wide range of diameters and also enables thin-film scribing. DFD 640 also features a heating stage and thermocouple, which enables precise temperature control. This ensures proper heat transfer to the material being cut and produces cleaner, more efficient cuts. The machine is equipped with an adjustable nozzle to allow for a wide range of focus sizes and shapes. Additionally, its sophisticated software allows for the rapid calculation of repeatability, accuracy and overall cutting performance. Finally, the tool includes a dust evacuator, which removes debris generated by the cutting process, preventing it from affecting the material being cut. DFD640 is an efficient, reliable automated asset designed to produce thin, uniform samples in a variety of shapes and sizes. Thanks to its sophisticated scribes, heating elements and dust evacuation, it is capable of offering high-speed performance and accuracy, while reducing the risk of contamination from particles in the cutting process. Furthermore, its adjustable nozzle makes it suitable for a wide range of sample sizes, and its repeatability and accuracy-calculating software allows for optimal cutting performance.