Used DISCO DFD 640 #9410685 for sale

Manufacturer
DISCO
Model
DFD 640
ID: 9410685
Vintage: 1996
Dicing saw 1996 vintage.
DISCO DFD 640 is a scribing/dicing equipment designed to give customers improved yield, higher quality and lower cost of ownership. At its core, DISCO DFD640 is a scribe/dice machine that can cut semiconductor wafers and other panels into different shapes and sizes. DFD 640 utilizes a CCD vision processor to scan wafers for positioning accuracy and to ensure integrity of sawing. It also has an advanced Dynamic Focus System, which keeps scribe and dice operations running at optimal levels and eliminates any stray splinters or debris. DFD640 also features an improved air knife design that produces sharp cuts with minimal micro-cracks. The pressure of the air knife is adjustable and the saw blade can be swapped out when more than one type of material needs to be processed. It has a high precision frame with X-Y-Z axes that are powered by direct-drive servomotors. The machine is designed to minimize vibration, as well as minimize the amount of energy needed to operate it. Additionally, its high speed re-spacing unit ensures fast and accurate repositioning of wafers and guides. DISCO DFD 640 has an easy to use interface with user-friendly menus and customizable standard recipes. The intuitive touchscreen display allows for easy customization of parameters like number of cuts, end point selection and dive depth. Furthermore, recipes can be edited on the fly without pre-loading the machine, making it easier to accommodate varying product requirements. In addition to its features, DISCO DFD640 is engineered with a flexible software solution that interfaces with peripheral equipment, Plant LANs, PCs, and other company floor systems. This makes it easier to monitor its performance and optimize any potential problem areas. It also has automatic wafer mapping, which simplifies the process of tracing wafer position by providing a graphical representation. Overall, DFD 640 is an advanced scribing and dicing machine offering customers decreased cost of ownership and improved yield and productivity. Its high-precision and user-friendly designs, coupled with its integrated software solution and flexible peripheral setup, make DFD640 a great choice for wafer and panel cutting operations.
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