Used DISCO DFD 641 #156561 for sale

DISCO DFD 641 is a scribing / dicing equipment designed to efficiently produce precise cuts on thin wafers and circuit substrates. The system uses a basic scribing mechanism in order to cut panels of solid material into individual die sizes within its rigid frame. DISCO DFD641 is an automated unit that utilizes state-of-the-art micro-sized diamond tip blades for precise movements and grooves for cutting. The blades are mounted to the end of the scribing machine that is fed into the material, and then each blade is guided by two linear actuators to create precise patterns within a single stroke. Therefore, the machine produces consistent and accurate cuts that require minimal energy and time. The cutting speed of DFD 641 is adjustable, allowing for maximum productivity and accuracy. The scribing machine also includes oil mist lubrication and dust spray protection to protect the blades and substrate from being damaged while they are being cut. This protection is necessary to ensure that the quality of the finished product is not compromised, as any damage to the substrate or blades can result in costly defects. DFD641's speed, accuracy, and protection methods make it ideal for producing precision thin wafers and circuit substrates that have to have extremely accurate and consistent shapes and grooves. The tool is also capable of cutting through copper, stainless steel, aluminum, and other thin metals, allowing for use in a variety of applications. In order to improve efficiency and accuracy, DISCO DFD 641 also utilizes a scribe marking asset with a CCD camera and lens. This model ensures that the blades are precisely and accurately aligned with the material that is being cut, while the CCD camera and lens helps to accurately determine the depth of the cut that is being made. As a result, the scriber scratch and cut mark left on the substrate are accurate and precise, improving the quality and consistency of the finished product. Overall, DISCO DFD641 is a capable dismantling and cutting equipment for producing thin wafers and circuit substrates. The system's use of micro-sized diamond tip blades makes it highly accurate, while the adjustable cutting speed, oil mist lubrication and dust spray protection provides the unit with added protection. The inclusion of the scribe marking machine and CCD camera and lens further helps to guarantee the accuracy of the cuts and quality of the finished product.