Used DISCO DFD 641 #293617661 for sale

DISCO DFD 641 is a scribing and dicing equipment developed and produced by DISCO Corporation for the semiconductor industry. It is a versatile system ideal for single-wafer processing, allowing for quick and precise processing of high-quality semiconductor wafers. The unit can be used to perform scribing, singulating, die bonding, and sorting processes while delivering a wide range of process speeds and precision. The machine is composed of several main components, including the vision tool, belt and conveyor asset, laser scribing model, and vision assist head. The vision equipment consists of the main camera and light source and a range of optical components. The belt and conveyor system is then responsible for automatically transporting and positioning wafers, while the laser scribing unit is used to cut and divide wafers into individual pieces. Finally, the vision assist head helps with the positioning of wafers in the machine, and is used to determine the spacing and size of each individual die. The tool is capable of processing up to 80 wafers per hour, each with a maximum diameter of 200 mm. Wafers can be processed at speeds of up to 0.8 m/s and accurate to a micron. The asset is also equipped with an archimedean flow chuck and all-in-one table plate, allowing for automated wafer loading, unloading, and breaking. Additionally, the model can be fitted with various additional tools to further increase its range of capabilities. Overall, DISCO DFD641 is a versatile scribing and dicing equipment capable of quick, precise, and high-quality processing of semiconductor wafers. Thanks to its compact design and low operating costs, it is well suited for applications such as wafer singulation, die bonding, and sorting.