Used DISCO DFD 641 #293625234 for sale

DISCO DFD 641 is a high-precision scribing and dicing equipment, used in the production of semiconductor components. It is designed to produce an accurate, medium-sized cut, usually made at a right angle, onto a piece of silicon or other wafer material. The system uses a CO2 laser that is focused by an optional Z-servo unit to ensure very precise cutting and positioning. The speed and precision of the scribing and dicing process are accomplished by a combination of high-speed positioning systems and a design that automatically adjusts the cutting speed, which can be altered for different materials and thicknesses. DISCO DFD641 operates on both sides of the DFD platform, providing good surface coverage. On the left side of the platform is the scribing head assembly and on the right side, the dicing head assembly. The scribing head features a granular alignment machine to ensure fine pitch, positional accuracy and repeatability of scribe lines. The scribing assemblies include the laser, lens, beam intensity control and X, Y and Z axis components. The laser and optics assembly provide a focused beam that is suitable for making accurate scribe lines on different materials. The beam intensity control tool adjusts the laser power according to the material being scribed. The dicing head assembly is composed of a optical sliding table, a frame for mounting the dicing saw and a cutting head for holding the blade. The dicing asset consists of a saw blade that is driven by a motor, either pneumatic or electric. The cutting depth and speed are adjustable, and the saw is suitable for cutting different materials including silicon, quartz and glass. The model has several safety features. Laser shielding is provided for protection against operators, and a special guard device is available for keeping debris away from the operator. The equipment uses automatic nozzle cleaning and flush systems to keep the laser cavity clean, which also helps to reduce power consumption and thermal expansion. Furthermore, a dust removal system ensures a virtually dust-free working environment. DFD 641 has a comprehensive software package that offers user friendly graphical interface and provides a wide range of features, including slicing, job programming, automatic material recognition, part cycling and unit operation monitoring. The machine can be connected to a PC or network for controlling and monitoring operations, as well as for data processing and storage. DFD641 is a reliable, versatile and cost effective tool for efficient scribing and dicing of wafers.