Used DISCO DFD 641 #293649755 for sale

DISCO DFD 641 is a multi-purpose dicing and scribing equipment from DISCO Corporation designed for a wide range of precision machining applications in semiconductor manufacturing, including the preparation of wafer surfaces and the cutting of LED devices. The system is a fully automated, high-speed 4-axis machine which is capable of making cuts in up to 4-20 μm accuracy and depth. It utilizes a three-part scribing process, which consists of a spindle, linear drive unit, and step-motor actuator, to accurately control the movement and tilt of the diamond blade used for cutting. The unit also includes a high-precision laser reader, which can be used to accurately read data including the width and length of the cut, as well as to measure the angle of the scsmt. All of the processes take place in a dust-free and temperature controlled environment. In order to meet its high level of accuracy, the machine uses high-speed laser radiation heating. This helps to ensure a smooth and even cutting process, as well as reducing potential thermal damage to the material being worked on. The laser radiation heating also helps to reduce vibration in the cutting process, allowing for greater accuracy in the wafer processing operations. DISCO DFD641 is extremely user-friendly, with a touch-screen display for simple operation. The tool also includes a safety asset, ensuring that laser radiation is only activated during actual machining operations. In addition to the above mentioned features, the 641 also offers several additional functions such as the option to set up multiple jobs simultaneously, as well as changing the settings in real time if necessary. Furthermore, the model comes equipped with various software upgrades and analysis functions, such as TFT size analysis, 3D measurement, parameters setting, position and size setting and histogram analysis. Overall, DFD 641 is a perfect balance between a powerful and highly-effective machine, and optimum user-friendliness. It is ideal for a wide range of dicing and scribing operations in the semiconductor industry, and a must-have for those in the profession.