Used DISCO DFD 641 #9075800 for sale

DISCO DFD 641
Manufacturer
DISCO
Model
DFD 641
ID: 9075800
Automatic dicing saws.
DISCO DFD 641 Edger is a scriber/dicing equipment specifically developed for edge processing of wafers. It is able to provide precise cutting, creasing, and edge grinding operations to a wide range of materials like quartz, sapphire, LCD, and silicon. It is suitable for high-volume production needs as well as small-quantity jobs. DISCO DFD641 has been designed for a trouble-free processing with low maintenance requirements. DFD 641 features an isolated, automatic loading system which is powered by an AC servomotor. The machine also boasts an ultra-wide edge processing range with a maximum of 400 mm and a minimum of 40 mm. Its processing capacity ranges from 0.08 up to 2.0 mm in thickness. The scribing machines can also be equipped with vision systems, enabling precise edge positioning. The machine is equipped with the highest grade processing requirements, consisting of a low-noise, high-durability spindle. The spindle is coupled with a spindle bearing of the highest quality, while the blade is also made with superior tools and materials. Their superior quality ensures that even weak materials, such as quartz and sapphire, can be accurately cut. The machine's cutting speed adjustment enables precise control of cutting width, which facilitates fast and accurate processing cycles. The cutting performance is closely monitored by optimizing process times, ensuring that required processing is completed quickly and accurately with minimal waste. DFD641 also features an internal storage unit for quenching blades and liquid hotblade. This allows for quick and easy cleaning of blades, even during processing operations. The cutting performance is further improved with the advanced blade sharpening unit. The internal blade cleaning and sharpening machine provides quick and accurate blade sharpening with special vacuum suction for improved dust collection. DISCO DFD 641 is an efficient tool for edge processing needs in a wide range of applications, such as LCD and mobile device production, electronics inspection and machining, and surface-mount technology. The reliable performance and low maintenance requirements of the machine make it a great choice for wafer cutting operations. This tool is renowned for its excellent productivity and superior quality of edges, and thus, significantly reduces unnecessary waste and cost.
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