Used DISCO DFD 641 #9099902 for sale

DISCO DFD 641 is a scribing and dicing system for circuit board production lines. The system is designed to remove unwanted material from a panel of test substrates through a number of different processes. This is accomplished by scribing, scoring, and dicing the substrates with precision. Scribing leaves visible marks in the substrate that are precise and allow for an easy location of breakpoints. Additionally, during the scribing process, a laser beam removes small parts of the substrate, leaving a very precise linear trail in the substrate material. The scriber also has the ability to make intricate shapes with a variety of contour options. Following scribing, the panel is then subjected to a scoring process. This process consists of slicing along a scribed line with a thermally controlled cutter. The cutter melts away a portion of the substrate to leave a clean, smooth score line. This score line delineates where the test sample should be broken off, and allows for easy removal without damaging other components of the circuit board. Once the panel has been scored, the sample must undergo a dicing process. Dicing is an important step in board assembly, for it removes the unwanted parts of the substrate that are not needed for the circuit board. Dicing is accomplished through the use of a saw blade, which is lowered onto the substrate with the use of a servo motor. This saw blade then follows the contours of the substrate, precisely removing the unwanted material. Finally, the panel is subjected to a deburring process, in which the edges left behind by the slicing and dicing processes are inspected and manually buffed. The reason for this is to ensure that all components on the board have safe and smooth edges, as sharp and jagged edges can cause damage to components during the assembly process. In conclusion, DISCO DFD641 is a versatile scribing and dicing system that is designed to provide a precise, safe, and efficient way of separating unwanted material from a test substrate. Its powerful combination of laser scribing, scoring, saw blade dicing, and deburring provide a reliable and repeatable way of creating intricate shapes with minimal wastage of substrate material.