Used DISCO DFD 641 #9361897 for sale

DISCO DFD 641 is an automated scribing and dicing equipment designed to quickly and accurately create edges, surfaces, and shapes on various materials. This system is ideal for custom fabrication projects that require precise scribing or dicing of semi-conductive materials such as silicon, sapphire, and quartz. DISCO DFD641 features three control modules: the main unit, a vision module, and a scribing operation table. The main unit consists of a controller, communication cable, and a port for connecting to a computer. The vision module is a camera and light source combination that provides images and a complete 3D view of the sample. The scribing operation table features a reinforced roll-brush that helps keep the scribing head in contact with the surface. DFD 641 unit also includes a processing program designed to maximize efficiency and minimize waste material. The machine is operated by a multi-process approach that allows for high precision cutting results using a combination of scribing and dicing. The series of processes begins with loading the material into the machine. The sample is then placed on the roll-brush of the scribing table and the vision module identifies the target region for scribing and produces a high-resolution 3D image of the sample. The tool then processes the image using a series of algorithms to determine the best cutting parameters. Once the algorithms are complete, the scribing operation table is engaged to begin the automated scribing and dicing process. The asset can quickly and accurately create edges, surfaces, and shapes on semiconductor materials using different scribing and dicing angles.The result is an efficient, accurate, and consistent fabrication process. DFD641 is ideal for a variety of cutting and machining applications in the semiconductor industry. This advanced model eliminates the need to manually scribe or dice materials, and it provides a high degree of accuracy and consistency. The versatile equipment is capable of creating accurate shapes and surfaces at varying angles and is capable of processing multiple samples simultaneously. The system is designed to maximize efficiency while minimizing material waste, delivering consistently accurate results at high speeds.