Used DISCO DFD 641 #9384760 for sale

DISCO DFD 641 is a scribing and dicing equipment designed to produce a variety of intricate shapes on semiconductor wafers. This state-of-the-art system utilizes a precise combination of laser cutting technology and scribing techniques to produce designs that are accurate down to a few micrometers. The result is a combination of both delicate and precise features for use in a variety of customized chip designs. DISCO DFD641 is a two-step unit; the scribing process is used to first cut the wafer into a desired pattern, while the dicing process is used to further refine the design by slicing the wafer into individual chips. The scribing process utilizes laser cutting technology to cut lines through the wafer that are accurately placed down to the micron. It can be programmed to accurately draw lines of various widths and depths on the wafer, as well as three-dimensional curves and intricate designs. The second step of the machine is the dicing step, which further divides the wafer into smaller units by cutting across the pre-scribed lines. This is a precision process that requires a moderate amount of force and a high degree of precision to ensure accuracy throughout. The tool utilizes a specially designed diamond-tipped blade that allows it to slice through the wafer down to the micrometer level. DFD 641 is a highly versatile tool that is capable of completing both scribing and dicing operations on a variety of substrates and wafer types. It is also capable of accurately sculpting intricate profiles and cutting custom shapes with ease. This advanced asset takes only minutes to complete a job, offering a fast and reliable solution for a wide range of product designs. It is a trusted tool used by many leading aspects of the semiconductor industry due to its accuracy, quality, and speed.