Used DISCO DFD 641 #9400955 for sale
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ID: 9400955
Wafer Size: 8"
Dicing saw, 8"
Maximum work piece size: Φ8"
Tape frame: 2-6, 2-8
Maximum rotating angle (θ-Axis): 380°
X-Axis:
Cutting range: 210 mm
Maximum cutting speed: 0.1 - 450 mm/s
Y-Axis:
Cutting range: 210 mm
Index step: 0.0001 mm
Single error: 0.002 or less / 5 mm
Positioning accuracy: 0.003 or less / 210 mm
Scale resolution: 0.0002 mm
Z-Axis:
Maximum stroke: 7.2 (for ø 2" blade)
Moving resolution: 0.00025 mm
Repeating accuracy: 0.001
Maximum blade size: Φ 55.56
Spindle:
Output: 1.0 at 60,000 min^-1 kW
Torque: 0.16 N-m
Revolution speed range: 6,000 - 60,000 min^-1.
DISCO DFD 641 is a high-precision scribing and dicing equipment designed for use in the semiconductor industry. The system is ideal for cutting die and molding applications in the production of integrated circuits, thin-film transistors, light-emitting diodes, and other micromachined devices. DISCO DFD641 utilizes a diamond-cut saw blade to provide the highest level of accuracy and the best surface finish. This makes it ideal for high-end applications such as IC fabrication and thin-film technology. The unit is capable of monitoring beam power, providing a consistent and stable cutting process. The scribe speed is adjustable, and the machine features automatic compensation for scribe variations, enabling precise and uniform cutting. The tool is also equipped with a patented multi-axis MEMS (micro-electromechanical systems) stage. This advanced stage design provides extremely high precision and stability, allowing for precise and repeatable scribing. The asset includes a high-resolution camera that provides real-time feedback, enabling users to make corrections quickly and easily. DFD 641 is designed for minimal maintenance and high-quality performance. The model is designed for fast setup, and its intuitive control panel simplifies operation. The high-end components and precision engineering ensures long-term reliability, and the equipment is backed by DISCO commitment to customer service. Overall, DFD641 scribing and dicing system is a reliable and accurate unit that is ideal for precision scribing applications in the semiconductor industry. Its high-precision scribing capabilities, advanced MEMS stage design, and intuitive control panel make it an ideal solution for die and molding applications, as well as IC fabrication and thin-film technology.
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