Used DISCO DFD 650 or 651 #293665902 for sale

DISCO DFD 650 or 651 is a scribing and dicing equipment designed for the semiconductor processing industry. It is designed to make the precise process of separating and shaping wafers or other substrates easier and more efficient. The machine features a high-end contact blade head designed to provide maximum accuracy and reliability, along with a three-axis scribing motion for precise, repeatable positioning. The system also includes a high speed vacuum controlled pick-and-place wafer handling unit for unloading and loading substrates from the blade head. DFD 650 or 651 is capable of handling wafers measuring up to 200mm in diameter, with a thin layer or micron-sized blade for fine cutting thickness. The machine is able to precisely scribe and dice wafers and substrates for a variety of semiconductor manufacturing applications, such as slicing aluminum oxide wafers, preparing substrates for die bonding, and creating electronic packages. The automated, computer-controlled tool is designed to increase throughput and process robustness while also reducing labor time and the risk of human error. The automatic pick-and-place asset is designed to move wafers to and from the machine's blade head quickly and accurately, with minimal mechanical damage or breakage. The model includes a laser alignment equipment for accurate wafer targeting, along with a wafer pick-up arm and loading system, designed to ensure easy, ergonomic loading and unloading of the substrates. In addition, the blade head features a self-correcting, high precision alignment unit for ensuring accurate and precise cutting of the substrates. The machine also includes a finely adjustable rocking and vibration tool to improve the cutting accuracy, and it can be fine-tuned to accommodate a variety of processing parameters. The asset has a maximum cutting speed of 800mm/sec, and it features a controller for precise pattern and blade height control. Ultimately, DISCO DFD 650 or 651 model is a reliable, cost-effective scribing and dicing equipment for semiconductor manufacturing applications. Its combination of robust components and intuitive software make it an ideal choice for precision industrial applications.