Used DISCO DFD 650 #293609792 for sale

DISCO DFD 650 equipment is a scribing / dicing system that is ideal for precision cutting, marking, sorting and separating of brittle materials such as semiconductor wafers and other materials. The unit utilizes a diamond cutting blade to create precise cuts with superior quality and excellent repeatability, while also protecting delicate substrates and reducing material loss. DISCO DFD650 features a high-performance motor to drive the cutting action that delivers quick response, low vibration, and low noise levels. The machine also boasts a user-friendly, intuitive touchscreen user interface, enabling quick and accurate input of the desired cut parameters. The motor is controlled by a feedback tool to provide superior cutting control and accuracy, allowing the operator to accurately specify a cutting speed and pressure. The asset comes with a pallet and clamps, which enables high-precision alignment of substrates when dicing. Optional accessories include additional pallets to accommodate larger substrates and various blade fixtures to ensure improved cutting accuracy. Additionally, the model is equipped with multiple modules for finer segmentation, including PM and DM blades, T-type blades, and twin blades that can cut a range of tougher materials like ceramics with ease. In addition to cutting, viewport microscopes allow the operator to securely target and inspect zones for precision orientation or location. The technology also includes a safety equipment, which integrates safety barriers and motion sensors that activate the stop function in the event of an emergency. The system is self-contained and requires minimal setup, and it requires minimal maintenance. Additionally, the unit features a dust collection machine and dust generation filters, ensuring clean and healthy working conditions and streamlined workflows. DFD 650 tool is an innovative, cutting-edge solution to the needs of precision cutting and separation. Its high accuracy, repeatability, and durable design make it the ideal choice for demanding fabrication applications in the production of semiconductor wafers, packages, circuits, substrates and other materials. The asset provides superior returns in terms of time, cost and tangible performance to enable users to efficiently and reliably create a wide variety of intricate designs for the most demanding applications.