Used DISCO DFD 650 #9101863 for sale

DISCO DFD 650 is a purpose-built scribing / dicing equipment for a variety of scientific and industrial applications. It is designed to accommodate a wide range of substrates and samples, including sputtering, etching, thin film deposition, and waveguide laser cutting. The system utilizes a fully-computerized, high resolution X-Y-Z motion control unit with automated debris-removal, detection, and safety features. It offers a highly adaptable cutting platform that can be tailored to a variety of applications, such as fine-wire bond cutting, laser cutting of highly reflective materials, and ablation of metals. Additionally, a variety of options are available depending on sample requirements, such as auto-feeding and re-threading, 2D profile generation, spot placement, and fiducial marking. DISCO DFD650 features the latest, state-of-the-art, high-performance scribing tools combined with exceptional accuracy and precision achieved with the proprietary and patented "Dices" pattern recognition technology. The Dices technology, which responds elegantly to the varying shapes, textures, and sizes of various substrates, offers the ability to rapidly scribe lines, curves, and contours of various width and depth with excellent clarity and straightness. With an advanced detection and control machine, the tool is able to detect any debris generated in the scribing process and is able to handle rough-edged and brittle samples without damaging the material. The high-precision control asset consists of a servo-controlled MAX® integrated platform, offering increased chatter and vibration reduction, and cycle times. Its powerful turn-table technology ensures smooth and precise rotational motion. The flexibility of its X-Y-Z control allows simple and multi-dimensional patterns to be created with minimal user interaction. It also offers convenient model setup, adjustment, and calibration, with a touch-screen interface and a selection of parameters that can be tailored to the desired application. DFD 650 is designed for easy integration into manufacturing lines and is compatible with a wide variety of materials processing tools, systems, and other related equipment. Its robust design and construction ensure hours of unattended operation and reliable performance. Suggested applications include preparation of substrates for thin film deposition, nanosized cutting and scribing, laser beam drilling, optical glass cutting, panel cutting, waveguide laser cutting, and matrix cutting. It is also suitable for solar cell and display panel production.