Used DISCO DFD 650 #9101864 for sale

DISCO DFD 650 is a state-of-the-art scribing and dicing equipment developed by DISCO Corporation. The system automatically processes wafers of up to 8 inches in diameter and with a thickness of up to 0.5 mm, making it capable of handling various types of wafers used in the semiconductor industry. It is equipped with a high-speed, high-precision diamond blade designed to achieve precision of ±2µm and can handle a variety of materials such as quartz, glass, ceramics, borosilicate and others. The unit utilises a patented ceramic centring technology allowing for long-term accuracy of ±200µm by continuously compensating for workpiece tolerance. The machine also features a dry type CCD camera for accurate image recognition, enabling precise image processing. A variety of operator interfaces are provided such as a graphical user interface for presetting shape parameters such as scribing line width, step width, hatched area size and the number of repetitions. DISCO DFD650 also offers flexible settings for materials, shapes, line widths and performance ensuring that the highest quality and consistent results are achieved. The new tool has a high processing speed of up to 600 pieces per hour which is powered by a dedicated Windows-based control asset. In addition, the superior confidence-building model ensures reliable operation and close monitoring of all processes. This scribing and dicing equipment is an ideal solution for precision manufacturing and other related processes.