Used DISCO DFD 650 #9104618 for sale

DISCO DFD 650 is a scribing / dicing equipment that provides advanced scribing and dicing capabilities in a single integrated platform. DISCO DFD650 dicing system offers a loading platform that is capable of moving the wafer up or down into the head with a new positioning accuracy of 0.25 microns, enabling precise scribing and dicing of even the most complicated die and wafer shapes and sizes. The unit utilizes an updated version of DISCO razor saw, which offers improved blade life and an improved taper accuracy. The machine utilizes advanced scribe techniques to enable perfect dicing paths in the wafer on the first pass with consistent edge chamfer size of less than 0.25 microns. The machine also features an automated wafer bracket tool to allow seamless integration of various wafer sizes and types. DFD 650 scribing/dicing asset utilizes a vision model to detect die, chip, or wafer boundaries. Utilizing the Cencorp PatProcessor, the equipment is able to accurately separate chips with up to four different scribes on each side of the chip. Additionally, the PatProcessor can support up to four different shapes and sizes of chips in the same wafer. Furthermore, the system is capable of detecting and tracing back any mis-started dicing processes, allowing for a wide range of chip sizes and shapes to be diced with minimal waste and errors. The unit also has the capability to interface with other means of automation such as wafer robotic handling systems, post-dicing alignment systems, vibrating tool holders and wafer thermal management systems. DFD650 offers outstanding cutting performance, providing a high quality product with consistent chip-to-chip width and uniform chamfering size. The machine also offers the highest process consistency with quick tooling change-over times due to its large blade library and automatic tool setting and fast blade-sharpening capabilities. The tool runs on a Windows XP or later operating asset and is CE compliant. The machine is also equipped with a full set of safety features, including reinforced steel housing, shielded rotational saw blade, and motion slide guard model. In conclusion, DISCO DFD 650 is an advanced scribing / dicing equipment that provides precise chip separation, improved blade life, and a vision system for detecting die boundaries. The unit is capable of interfacing with other automation components, and offers outstanding cutting performance with minimal waste. The machine is compliant with all CE standards and is equipped with numerous safety features.