Used DISCO DFD 650 #9119603 for sale

DISCO DFD 650 is a state-of-the-art scribing and dicing equipment specifically designed for the packaging and die trimming of semiconductor wafers. This system is designed to maximize producivity and accuracy, while keeping costs and downtime to a minimum. DISCO DFD650 is based on a highly configurable and modular platform that can be adapted to suit various dicing solutions. Its dual-rail motion unit ensures precise and accurate positioning. It features full automation operation with automatic loading and unloading of wafer cassettes and unloading of dice. It also offers an integrated scanning machine and an optional automated wafer-edge inspection tool. At the heart of the asset is a high-speed, high-torque brushless servo motor with a maximum speed of 93000rpm, providing accelerated material removal during the scribing and dicing process. The model also features a high-resolution floating head equipment for precise positioning of the scriber. This ensures a more accurate cutting line, as well as more consistent and even edge. The system is designed to minimize operating costs. It offers reliable and consistent performance with minimal maintenance, as well as extended longevity of consumable components. In addition, it features user-friendly & intuitive operation, as well as an intelligent error-recovery function that minimizes production downtime in the event of an unexpected problem. Overall, DFD 650 is highly robust and reliable scribing and dicing unit that provides maximum performance with minimal downtime. It is ideal for high-volume production of packaged and die trimmed wafers, and is well-suited for a variety of applications.