Used DISCO DFD 650 #9366867 for sale

DISCO DFD 650 is a state-of-the-art scribing and dicing systems that offers precise and reliable processing of semiconductor wafers. Scribing and dicing are essential components of semiconductor wafer processing, as it enables accurate and accurate splitting of wafers into dies and chips that are polygonal shape. The equipment comes with a high precision scribe table that allows for line widths as low as 5 μm and with high accuracy displacements at a speed of up to 50,000 μm/sec. It can achieve precise splitting with dicing capability up to 30 mm in thickness and maximum wafer sizes of 300 mm in diameters. The basic features of the system are its non-contact laser scribing technology, high accuracy displacements, support for analog servo-controlled scanning, secure work holding using vacuum and standard drills, the possibility of combining both laser and mechanical cutting, 35 kW scribe laser output power, and frequency of up to 500 kHz. It is also equipped with a special laser scanner that ensures accurate scribe line widths and a high-speed zooming capability of up to 180 times. This unit offers numerous features that improve its capabilities, like the built-in, active vibration damping of the work table which provides stable and precise cutting performance. Furthermore, it also utilizes a specialized optics machine that increases scribe line control. This enables it to achieve a fine line accuracy of better than 5 μm, ensuring the best conditions for DI (Dry Isolation) and shallow trench isolation (STI) applications. It also supports both the ability to process wafers with a single or multiple scribe lines. DISCO DFD650 also comes with standard dicing blades, as well as specialized blades for ID or STI applications. It also allows for the combination of both mechanical and laser cutting, enabling users to maximize production efficiency. The tool is also highly automated, allowing users to program it for complex operations, and track the progress of the cutting process. This provides a cost-effective and reliable process for the production of high quality semiconductor dies and chips.