Used DISCO DFD 650 #9409462 for sale

DISCO DFD 650
Manufacturer
DISCO
Model
DFD 650
ID: 9409462
Dicing saw.
DISCO DFD 650 is a highly advanced scribing and dicing equipment designed specifically to meet the demands of the semiconductor industry. It uses a state-of-the-art optics system, combined with proprietary software and hardware systems, to efficiently and accurately split even the smallest and most complex of samples. The unit is designed to easily handle wafers between 2 and 8 inches in diameter, with both conventional and advanced dicing modes. The latter uses a linear motion machine with additional motor control for maximum accuracy. It is also able to process 'on the fly' edge repairs for cutting of split wafers. The main components of the tool include a scribing table, cutting head assembly, linear motion asset, and scribing illumination. The scribing table is designed to remain fixed while the cutting head moves within the linear motion model. The cutting head is an adjustable cutting assembly used to create the desired pattern on the sample. The cutting head includes a scribing laser, a set of lenses and other components to adjust the scanning angle. The linear motion equipment is an electromechanical system which moves the cutting head to the desired cutting positions. Finally, the scribing illumination comes from a bright, uniform line of light which creates the desired cuts on the sample. The software and hardware systems of DISCO DFD650 have also been designed to increase efficiency and accuracy. Its intelligent cutting algorithms analyze the sample and create cutting patterns of varying degree. Additionally, the unit can accurately place cutouts, detect and analyze shapes, and remotely change the cutting mode. To ensure reliable operation, DFD 650 has been designed with temperature stability, gyroscope technology, vibration control, and an in-line inspection machine to perform verification of cutouts and final quality assurance. In conclusion, DFD650 is a highly advanced scribing and dicing tool specifically designed to meet the demands of the semiconductor industry. Its features provide maximum accuracy and efficiency while its advanced software and hardware systems ensure reliable operation.
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