Used DISCO DFD 651 #293608737 for sale

DISCO DFD 651 is a high-end scribing and dicing equipment designed to perform complex material processing operations and maximize uptime. The system can be used to process a wide range of materials, including silicon, GaAs, SiC and other compound materials. DISCO DFD651 utilizes an advanced scribing and dicing solution which features fast and accurate stroke-cut technology. The unit is capable of processing materials at rates of up to 600mm/s, and cutting depths up to 6µm. For processing of materials, DFD-651 utilizes a unique machine which ensures precise positioning of substrates while avoiding damage to fragile substrates. This tool includes a high-speed scriber head, laser renderer, map-to-map processor, and indexing mechanism. Once the map of cuts has been determined, the scriber head will then proceed to accurately cut and divide parts into the desired size. DFD651 also features a highly efficient cooling asset, allowing for minimized thermal-induced aberrations to the parts being processed. Heaters in the chamber keep substrates stable during scribing and slicing operations, improving the overall accuracy and reliability of the model. For additional reliability and accuracy, DFD 651 has an optional Dicing Enhancement Kit (DEK). This set of add-on components adds a high-precision diamond saw to the equipment, allowing for even more accurate dicing. The DEK also adds in additional cooling and sensor control systems, ensuring that the diamond saw is able to accurately and consistently perform cuts to the desired specifications. DISCO DFD-651 is capable of performing both semi-finished and finished parts processing. The scribing and dicing system provides high quality outputs and is a reliable and cost-egalitarian solution for industries looking to achieve high levels of productivity. The combination of its capabilities in terms of both cost and performance make DISCO DFD 651 the ideal scribing and dicing unit for material processors of all types.