Used DISCO DFD 651 #293617696 for sale

DISCO DFD 651 is a high-precision cutting equipment for complex, precise business such as scribing and dicing processes. It utilizes a unique combination of traditional mechanical cutting technology, such as diamond blade and abrasive belt saws, with laser scribing and dicing methods to provide a wide range of slicing capabilities. In terms of the traditional saws, DISCO DFD651 utilizes a diamond blade saw with a maximum cutting depth of up to 130mm, and an abrasive belt saw with a maximum depth of 70mm. These saws are used on materials including silicon wafers and range of electrical insulators, and other materials such as Quartz, sapphire and doped glass substrates. The diamond blades are designed to maintain precision, while providing a smooth and clean finish. The system also has a high-precision laser scribing and dicing unit, which is capable of scribing lines as fine as 5μm and cutting thicknesses up to ±1% of the wafer thickness. The laser cut speed is adjustable, and it offers high accuracy for large and complex substrates, as well as for small and extremely fine substrates. In terms of safety, DFD-651 is equipped with a dust-collecting machine to ensure a safe operation and environment. The minimal personal safety gear required during operations is a face shield, goggles, rubber gloves and lab coat or other suitable clothing. DFD 651 is an advanced tool that ensures efficient and precise slicing for various applications. It has the capability of achieving higher cutting speeds and providing cleaner, consistent results. Additionally, the use of precision laser cutting and scribing enable the asset to effectively cut more complex substrates and perform intricate scribing patterns, which is ideal for some industries and applications.