Used DISCO DFD 651 #293826708 for sale

DISCO DFD 651 is a scribing and dicing equipment for thin-film substrate materials and semiconductor processing applications. The system is capable of producing various custom-shaped cuts, grooves, or notches with precision and accuracy on thin film materials such as Silicon wafer thinning, Copper thinning, and other substrate thinning materials. The unit utilizes a high-speed scribing wheel that is driven by a direct-drive high-accuracy servo motor and utilizes advanced control algorithms. This wheel is tilt adjustable and can scribe at angles of 0-90 degrees. The machine features hi-resolution CCD cameras that are used to determine the exact scribing wheel path and ensure consistent positioning on the thin-film substrate. It also has a sensor tool that can detect any obstacles that the wheel may encounter while cutting, and can adjust the wheel movement accordingly to maintain accurate and consistent cuts. The asset's automated alignment algorithm allows it to precisely position the wheel prior to each cut, ensuring accuracy. The wheel also has a dual-mode model, allowing it to simultaneously cut and scribe in either direction with exceptionally high speed, precision, and accuracy. DISCO DFD651 equipment is compatible with a large variety of substrates and thin-film materials, which can be divided into two types: polysilicon wafer thinning substrates and metal thinning substrates. Polysilicon wafer thinning is achieved through a process known as CMP (chemical mechanical polishing), while metal thinning can be done through a process of electro-discharge machining. In addition to offering similar features as DFD-651 system, it can also be used for dicing and beveling, which involves cutting along a line to create straight cuts and angles of up to 45 degrees. Furthermore, the unit is equipped with an advanced laser cutting machine for accurately cutting small and detailed patterns. DFD 651 tool is designed for efficiency, eliminating the need for a manual process. Not only this, the asset is also energy efficient, with a very low power consumption to minimize costs. This model has been designed to be extremely robust and is a reliable solution for accuracy and repeatability for thin film substrate materials and semiconductor processing applications.