Used DISCO DFD 651 #9056937 for sale

DISCO DFD 651 is a scribing and dicing equipment used to prepare wafers for semiconductor production. It can accurately handle wafers up to 12-inch diameter and achieve a minimum line width of 2.5μm. The system is able to accurately control the pressure while processing and can process the wafer in two or four-axis configuration. The patented pressure control technology ensures accurate and repeatable processing, and provides a higher quality cut of materials. With the optimized feed speed and pressure control, the unit can achieve smooth and accurate dicing of wafers up to 3mm thick. It also offers high process stability and repeatability due to its closed-loop pressure control machine. The machine is equipped with six independent scribe heads with four alternating diamond saws and two ultra-sharp scribing styluses for high precision scribing. It is capable of scribing lines with widths as fine as 2.5μm, which ensures accuracy and repeatability. The machine also features a dual-axis linear stage and specialized air bearings for precise alignment and smooth movement. DISCO DFD651 scribing and dicing tool is easy to operate and features an intuitive human-machine interface, which allows users to quickly configure the equipment. It also features a full range of advanced safety features to ensure safe and reliable operation. The asset can be used for a variety of applications, including semiconductor packaging, MEMS fabrication, optoelectronic device fabrication, and micro-optics production. DFD-651 is an industry-leading scribing and dicing model that offers superior performance and reliability. With its cutting-edge technology, the equipment delivers the highest accuracy and repeatability in the semiconductor industry. Its intuitive interface and advanced safety features make it an ideal tool for use in industries where precision and safety are paramount.