Used DISCO DFD 651 #9097294 for sale

DISCO DFD 651 is a scribing and dicing system, developed by DISCO Corporation, which provides a complete solution for preparing wafers and packages of devices such as semiconductors, liquid crystals, and MEMS. DISCO DFD651 system contains a laser dicing station (LDS) and a wafer scriber, both of which are designed for high-volume semiconductor device manufacturing. The LDS is capable of precisely cutting and singulating chips from the wafer with speeds up to 20,000 chips per hour. Features such as continuous exposure time and laser power control ensure high-quality cuts and accurate singulation, even for very fragile devices. The laser scriber enables flexible, high-precision marking of wafers, such as mask aligners and dicing grids, while handling wafers up to 300mm in size. DFD-651 offers a wide range of features to ensure consistent, high-quality production of semiconductors. It is capable of automatically loading and unloading a large stack of wafers, cutting and singulating chips simultaneously, and performing a scribing process with a resolution of 15 µm. Other features include a laser power monitor with an optical wavelength filter, in-situ contamination detection, an internal suction system for chip extraction, and optional alignment grid scanner. DFD651 is designed for high-volume applications and can be easily integrated into existing manufacturing processes and environments. It also offers automated diagnosis and maintenance services, software updates, and a secure data storage environment for output data. Furthermore, its integrated temperature control systems enable operators to adjust the temperature and humidity levels during operation. The combination of high-precision wafer scribing, high-speed dicing, accurate monitoring and control systems, secure data storage, and automated maintenance services makes DFD 651 a complete solution for device manufacturers requiring consistent, reliable, high-quality output.