Used DISCO DFD 651 #9100668 for sale

DISCO DFD 651 equipment is a scribing and dicing process developed by Japan-based DISCO Corporation that can be used to cut, scribe, and dice a wide range of materials such as silicon, quartz, ceramics, and most of the materials used for semiconductor packaging, including epoxy, fluoropolymer and rubber. The system is capable of cutting a variety of sizes, from die Level cut of 200 μm to 40mm thick Large Wafer. It also has high precision, with a cutting accuracy of up to ±0.6 μm (6 sigma) on the die level. DISCO DFD651 unit makes use of a high-performance fine micro-machining tool, DFD-651 Diamond Cutting Blade. This blade is capable of cutting a wide range of materials due to its diamond coating, and its cutting edge design that helps to reduce burrs and chips while cutting. Its running speed of 25 m/sec is ideal for quick and accurate dicing. With the simple control structure, setup and operation of the machine are easy to perform. The tool allows for a feed rate of up to 1.2 mm/sec, meaning it can quickly slice and dice materials. It has the high rigidity and high precision machining capability that are essential for a high-quality slicing and dicing of small substrates. DFD651 comes equipped with auto-sensing for cutting conditions such as height, force, and torque, which makes it usable for both manual and automatic processes. DFD 651 asset also includes a software package, DISCO Scribe, that makes it easy to setup, control, and monitor the scribing and dicing process. The software allows for automatic and manual model adjustment and control, as well as an audit trail for each piece of material cut with stored product data. It also offers remote control operation and makes it easy to customize the settings. DISCO DFD-651 equipment is ideal for a wide range of semiconductor components and cutting tasks. With its diamond-coated cutting blades and its specialized software, it can quickly and accurately cut, scribe, and dice a wide range of materials, making it the perfect system for high-precision semiconductor operations.