Used DISCO DFD 651 #9142670 for sale

DISCO DFD 651 is a scribing and dicing equipment that belongs to DISCO, a leading provider of semiconductor-processing equipment in Japan. The system is designed for efficient and precise separation of semiconductor wafers. It uses a combination of electric discharge machining (EDM) and highly accurate, computer-controlled scribing wheels to separate dies from the wafer. DISCO DFD651 has a number of key features that make it a top-of-the-line scribing unit. It has a highly accurate Laser image focus positioner to ensure clean dicing and scribing. The machine also includes a Simulteneous Scribing & Dicing (SSD) option, which allows for both processes to occur at the same time, driven by highly-sophisticated motion control. The machine also incorporates an automated debris suction tool that can capture debris generated by each process. DFD-651 is designed to process a wide range of material types and sizes, including silicon, glass and hard-ceramic, up to a size of 150mm. It is equipped with a four-axis tilting table that can tilt up to 20 degrees, allowing for flexible scribing angles and improved yields. The machine has an array of sensors and error-detection features to ensure a smooth operation and reliable results. It is equipped with a collision-detection asset, as well as dual-arm protection, which stops the machine in case of an unexpected movement. The model also includes an automatic dust-collection equipment to minimize air pollution. DFD 651 is capable of achieving high yields and throughputs. It has a maximum process speed of up to 3500 micrometers per second, with a throughput of more than 10,000 Wafers per hour. Additionally, the system can pick and place diced chips with its integrated robot arm, increasing overall productivity. In conclusion, DISCO DFD-651 is a highly-sophisticated scribing and dicing unit that offers excellent processing accuracy and reliability, as well as a high-degree of automation. It is ideal for semiconductor wafer trimming, as it is able to achieve high throughputs with minimal scrap and low energy usage.