Used DISCO DFD 651 #9184173 for sale

DISCO DFD 651 is a precision scribing and dicing equipment used for thin film and wafer processing applications. It features a wide range of cutting and scribing options, allowing for maximum flexibility for precise and accurate processing. The main components of DISCO DFD651 system include the controller, motor, laser head, optics, and sample table. The controller drives the motor, which is used to move the laser head through the cutting area. The laser head contains a high-power laser diode which emits a precise beam of light. The optics are then used to adjust the laser beam to the precise desired width and intensity. The sample table is used to securely hold the material in place while the laser is moving. DFD-651 unit is capable of cutting and scribing thin films and wafers up to 0.45mm thick. It can also provide precise cuts up to 0.03mm in size and up to 86.7mm in total length. Additionally, it is capable of operating at speeds of up to 9m/min. The machine is equipped with a thin-film specific optics design that reduces the amount of laser reflected light and improves the integrity of the cut. DFD 651 tool is designed for accuracy and repeatability. The laser head contains an adjustable focus lens that offers precise focusing and movement control, which is essential for repeatable results. Additionally, the asset can be programmed with a software program called DDControl that allows the user to easily input and save job parameters. This is especially useful when processing large batches of material as job parameters can be quickly and easily recalled. Overall, DISCO DFD-651 is a powerful and versatile scribing and dicing model that is capable of cutting and scribing thin films and wafers with the utmost precision and repeatability. Its features make it the ideal solution for thin film and wafer processing applications where precision and accuracy are key.