Used DISCO DFD 651 #9248669 for sale

DISCO DFD 651 is a 'scribing/dicing' equipment designed to be used for multi-layer processing and package substrate fabrication. This system combines both high precision dicing and scribing features, allowing for nearly automatic and simultaneous processing. The laser unit is capable of scribing, drilling and wafer-level packaging (WLP) to create lines and grooves of incredibly precise widths and depths. The precision of the scribing capabilities of the unit are complemented by the dicing functions. The dicing machine offers a wide range of cutting options including multipoint, step, diamond and thin films slicing. Allowing for processing at a much higher speed than traditional dicing methods. Moreover, the capabilities of the machine are extended by the presence of a Vacuum spindle which enables to optimally position the package substrate, ensuring uniformity with the scribing and dicing operations. DISCO DFD651,also features an adaptive force control feature, which allows for blade-contacting with the substrate to be adjusted according to the dimension of the substrate. This feature helps to optimize the precision of the cutting process and helps to reduce blade variation, wear and tear and further optimizes cutting results. Additionally, the tool also comes with additional features such as a CCD camera asset to indicate when the part has been cut and also acts as a monitor for the scribing and dicing process. This helps to ensure that all processes remain on track. All in all, DFD-651 is a highly precise and reliable scribing and dicing model, that helps to save both time and cost in the fabrication of multi-layer substrates and packages. It comes with various features such as the adaptive force control, a Vacuum spindle, and a CCD camera equipment, which further improves its precision and overall performance.