Used DISCO DFD 651 #9249943 for sale

DISCO DFD 651 is a scribing/dicing equipment that is capable of performing high-precision cutting, scribing and slicing of a wide range of materials. The system is built from DISCO Corporation's advanced Dicing Semiconductor Saws (DSS) technology, which allows for high-volume production of scribed dies and wafers. This technology allows for a variety of applications, including the creation of custom-designed dies for semiconductor applications. DISCO DFD651 is equipped with a high-precision, wide-speed direct-drive spindle. This spindle is capable of a rotational speed of up to 10000 RPM and can be adjusted as needed to provide optimal cutting performance. The spindle also features a tilt-adjustable spindle arm which provides a range of depths and angles of cut, allowing for a more versatile range of scribing/dicing operations. DFD-651 also features a micro chip processing unit that is capable of slicing and scribing thin film/ultra-thin film substrate materials precisely and quickly. This chip processor module is programmed with a dedicated software suite that is capable of generating cutting profiles and provides an accurate and time-efficient data input/output. This unit also provides a potentiometer setting which allows users to adjust the cutting speed and penetration force of the machine. Additionally, DISCO DFD-651 is integrated with a spring-pressure-controlled, high-curvature flow, scribing unit. This scribing unit is designed to minimize the need for post-scribing clean up, and features a self-lubricating, concave scriber wheel that is designed to reduce material adhesion and promote smoother cutting. DFD651 is equipped with a robust safety unit, featuring a self-diagnosis machine that monitors the running of the machine and provides warnings when conditions are not optimal. Additionally, the machine includes a shroud and guard tool to protect users' eyes and skin from possible danger. Overall, DFD 651 is a powerful scribing/dicing asset that is designed for maximum versatility and precision. It is capable of accurately and quickly creating a wide range of scribed dies and wafers, making it an excellent choice for high-precision semiconductor applications.