Used DISCO DFD 651 #9260934 for sale

DISCO DFD 651 is a scribing/dicing equipment for cutting wafers and other materials. It uses diamond-tipped fine blades to produce ultra-precise cuts with superior edge quality. This system offers high accuracy and repeatability, giving superior performance in precision dicing applications such as LED chips, MEMS and imaging elements. The unit is equipped with a high-speed, high-resolution air bearing spindle, allowing for incredibly precise cutting motions. The use of water-soluble coolant allows for superior cutting without unwanted thermal damage. The machine's feedrate control allows for precise control of cutting depth, helping to ensure accuracy and repeatability of cuts. DISCO DFD651 offers several cutting options, including standard scribing and dicing. Scribing stakes out the boundary of a material which will be cut into pieces. This process offers precise cutting of the material, while preserving its integrity. Dicing involves cutting the material into individual pieces. The precise cutting of DFD-651 helps to ensure that each cut is precise and uniform. The tool is also equipped with a powerful laser for automated part handling. This feature helps to prevent unnecessary operator errors, as well as allowing for quick loading and unloading of the asset. The model also offers real-time workpiece monitoring, allowing precise tracking and control of each cutting process. The real-time data also allows for precise feedback to the operator, helping to ensure process accuracy and repeatability. DFD 651 is designed for use in a variety of applications, from microetching to product packaging. Its air bearing spindle allows for high-speed cutting, and its laser feature allows for automated part handling. Combined, these features make this equipment ideal for high-precision cutting of wafer and other materials. Its compact design and highly reliable performance make it an excellent choice for industrial and medical applications.