Used DISCO DFD 651 #9261006 for sale

DISCO DFD 651 is an advanced laser scribing and dicing equipment developed by DISCO HI-TEC (Dry-process, Seiko-type Cutting Division, Kansai Works). It is comprised of a precision cutting head, coupled to a XY moving stage which allows for a wide variety of die sizes and substrates. DISCO DFD651 uses a laser beam to make a cut in the substrate material and then use a diamond blade to separate the cut material. This makes it possible to achieve incredibly precise cuts with minimal damage to the surrounding material. DFD-651 is exceptionally precise with a positioning accuracy of 1 µm and a repeatability of ±5 µm. This system features a high speed scribing cycle of 80-300 mm per second and a cutting speed of up to 5000 mm per second. The unit is able to cut materials up to a thickness of 2.5 mm and a die size of up to 150 mm by 150 mm. It also supports a wide range of materials including glass, ceramics and substrates such as paper or plastic. The variations of DFD651 are designed to support a wide range of applications. The plain version is designed for simple cutting and scribing processes, whereas the advanced version is designed for detailed cutting and dicing of semiconductor wafers and ceramic materials. In addition, the scribing and dicing machine feature a real-time camera providing feedback of the cutting process and a built-in laser safety feature. DFD 651 is a highly advanced and precise scribing and dicing tool that can meet the demands of various industries, from the semiconductor industry to the packaging industry. Its high speed scribing and cutting capabilities make it an ideal choice for high-volume production, while its high precision makes it the perfect asset for small, complex jobs. The model's safety features provide users with the assurance that their processes will be carried out safely and with the highest of quality results.