Used DISCO DFD 651 #9364473 for sale

DISCO DFD 651 is a professional grade equipment for scribing/dicing glass and ceramic substrates. The system utilizes high power lasers composed of CO2, YAG and Excimer laser sources with a wide range of capabilities. The unit can achieve micron-level accuracy and process glass, sapphire and other non-conductive materials with resolutions up to 20 μm (microns). Additionally, the high power lasers are capable of scribing, dicing, and cutting hundreds of substrates per hour. DISCO DFD651 combines high speed scanning, precision controlled cutting and intelligent software capability for maximizing cutting efficiency. State-of-the-art motion control technology provides finely tuned acceleration and deceleration to ensure accurate cutting in the most demanding situations. With the inclusion of the optional Auto-Focus head, the machine is capable of automatically correcting cutting height using digital feedback. In terms of operation, the process control interface is designed to be user-friendly and capable of self-monitoring maintenance alerts. The inclusion of data output software is designed to provide customers with customizable real-time job status information. The tool software provides several automatic pre-set cutting and dicing algorithms to accommodate a variety of substrates and patterns. DFD-651 provides several powerful tools to achieve optimum scribing/dicing results. Automatic nozzle cleaning devices protect the power head from foreign contaminants. Automatic vision systems inspect substrates prior to commencement of the cutting process and provide an exact count of the number of pieces cut from a given substrate. The asset also includes a variety of features to improve corner chipping and debris management. DISCO DFD-651 comes with a wide variety of supporting modules for handling and labeling substrates as needed. These include the Heated Lift Table, the Precision Feeder, and the Automatic Vacuum Cleaner. For substrate handling, the lift table can provide quick, accurate and repeatable height adjustments for substrates ranging from 0.5 mm to 9 mm thickness. For high quality patterning, the precision feeder offers precise distance control and increased stability. Finally, the automatic vacuum cleaner is designed to remove chips and debris generated throughout the scribing and dicing process. Overall, DFD651 provides an efficient, cost effective, and high quality solution for scribing and dicing materials such as glass, sapphire, ceramic, and plastics. The high power lasers are capable of accurately processing the most challenging substrates with resolutions up to 20 μm. With its automated laser protection, vision systems, and range of supporting modules, DFD 651 offers an unbeatable scribing and dicing capability.