Used DISCO DFD 651 #9378646 for sale

DISCO DFD 651 is a equipment for high-precision scribing and dicing in the production of semiconductor devices and other delicate, small-scale products. It is a self-contained, turnkey, integrated system that is capable of handling a variety of substrates and materials. The unit is uniquely designed to provide reliable, high-accuracy dicing, with microscopic control and large production runs. The machine is comprised of a scriber unit equipped with a galvo-controlled laser scanner, and a table that moves in the x- and y-axes and a z-axis platform. The scriber unit is capable of operation with both grooved and non-grooved substrates. It utilizes a 300, 600, or 1000-watt laser, depending on substrate material and other application requirements. The cutting head is designed with precise mechanical/optical/electrical alignment, and it is capable of precise focus control. The multi-axis table design enables precise 3D cutting and slicing. With a high-speed scan rate of 1800 Hz, it can produce precise scribing and cutting of materials quickly and accurately. DISCO DFD651 is also equipped with a unique cutting method called the Modified Kerf Method that allows for cutting with minimal waste and dispersions, particularly in fine-pitch materials. This utilizes a scribing process that precisely cuts the surface material to desired tolerances as it travels along the programmed cutting path. It is also optimized to achieve minimized material loss and surface finish. In addition, the tool includes a fully integrated, automated control and monitoring asset, as well as a user-friendly software with intuitive graphical user interface. The model is easy to set up and configure, and it can be operated offline with stored program parameters. It is well-suited for a variety of production environments, and it is compatible with various material handling systems. DFD-651 is designed to provide reliable, high-accuracy scribing and dicing processes for a variety of substrates and materials. With its high-speed, precise cutting and its efficient production capabilities, it is an ideal equipment for large scale production runs, as well as for small-scale, delicate operations.