Used DISCO DFD 651 #9392487 for sale

DISCO DFD 651 is a scribing and dicing equipment developed by DISCO, a leading supplier of semiconductor production equipment. The system is designed to create high-precision cuts and grooves on a range of substrates, such as semiconductor wafers, hard disks, and advanced digital and optical media. The unit features a 5-axis scribing mechanism, capable of a maximum scribing speed of up to 60 m/minute. The scribing mechanism contains a custom droplet generator, which can accurately dispense dedicated cutting fluid at precise intervals and locations on a substrate. The machine is equipped with image-based automatic substrate alignment, which enables precision detection and placement of the workpiece, ensuring precise and consistent cuts. Furthermore, a high-power laser offers precise cutting,grooving and marking processes, with speeds up to 60 m/minute. The tool comes with an intuitive and user-friendly software interface, allowing for easy setup and operation. Setup is simplified with automatic substrate ranging, resulting in faster and more precise automatic alignment. The asset is also suitable for use in wet or dry operational environments and can be used with a wide range of materials. The optional cutting mode allows for precise and consistent cutting of workpieces down to a width of 0.02 mm, making it ideal for applications such as fine-pitch device slicing, laser etching and dicing without kerf damage. The optional dicing mode adds a number of features, including in-feed dicing to promote a vacuum hold, high-power laser cutting, linear acceleration and variable beam speed. This mode enables precise fast cutting of wafers, disks, and other substrates, including large panel materials. As a versatile and reliable model, DISCO DFD651 is an advanced tool for precision scribing and dicing applications. Its compact design, easy setup and user-friendly interface, and accurate and consistent cuts make it well suited for a wide variety of applications.