Used DISCO DFD 651 #9395329 for sale

DISCO DFD 651 is an industrial scribing and dicing equipment used for the production of silicon wafers and other passive components. It features a high-performance scribing head for precision sawing of small and large wafers, as well as a large wafer carrier that can accommodates up to 200mm diameter carriers. The system is integrated with advanced motion control and software for efficient motion that can accelerate up to 400mm/s at a resolution of 0.01mm. A large, high-resolution graphics control unit produces accurate, smooth and fast scribing speeds with consistent results. DISCO DFD651 includes a reliable dicing procedure that offers high-depth cutting at speeds of up to 8500 cuts per second, ideal for processing hard substrates such as silicon wafers. A laser beam controller, high-precision drive machine and optical diagnostic systems are all integrated into the tool to ensure precision accuracy in scribing and dicing processes. The asset can also be connected to an external PC or programmable logic controller (PLC) for enhanced control and data transfer. DFD-651 features a wide selection of scribing features that include a high-accuracy scribing optical model, a high-precision digital vision, and a tool offset equipment for short-length cutting. The scribing module also features a laser spot scriber, which is capable of producing high-quality scribe lines for a wide range of applications. Additionally, the laser power can be adjusted to increase the throughput and accuracy of the scribing process. DFD651 system integrates an advanced waste-management unit, which ensures that the wafer central portion is left as untouched as possible, ensuring minimal dust and debris collection. Additionally, the machine has a range of safety features such as a safety light curtain and warning lamp to completely prevent accidents while scribing or dicing wafers. DISCO DFD-651 is a highly accurate, reliable dicing tool that has been specifically designed for the production of silicon wafers and related passive components. With its state-of-the-art scribing and dicing technology, the asset is capable of providing high yields and accurate results, with consistent quality. With its integrated safety and waste management systems, it offers a safe and efficient solution for the production of silicon wafers.