Used DISCO DFD 651 #9396228 for sale

DISCO DFD 651 is a scribing/dicing equipment system for semiconductor processing. It enables the accurate and precise cutting of a wide range of complex semiconductor materials such as silicon wafers, in preparation for processing. The unit utilizes laser scribing technology, using laser beams to 'scribe' lines around the edge of a precisely placed silicon wafer. The laser beam is focused very closely to the substrate, which has the advantage of achieving very precise control over the scribing line, to ensure that it follows the desired process parameters. The intensity and stiffness of the beam can be adjusted to suit the material properties and thickness of the substrate, creating consistent results with clean, smooth edges. The laser scribing process is followed by a 'dicing' step, in which the scribed sections are separated from the silicon wafer. DISCO DFD651 utilizes a high accuracy, diamond-coated blade to cut through the wafers along the scribe lines, achieving a clean and precise separation. The blade is motorized and can be moved along the X, Y, and Z axes to achieve very precise control over the dicing process. This is able to achieve clean cuts with minimal debris, significantly speeding up the process. A key advantage of DFD-651 is its scalability. It can process from 8" to 12" silicon wafers, and can also be used to cut smaller individual pieces. This makes it suitable for a wide range of semiconductor fabrication processes. The machine is also easy to operate and is user-friendly, making even complex semiconductor applications quick and simple to complete. DFD 651 provides reliable, accurate and repeatable scribing and dicing operations, making it an ideal choice for semiconductor fabrication. It simplifies the process and increases the speed and precision of scribing and dicing, helping manufacturers to meet tight production and quality deadlines.