Used DISCO DFD 651 #9404471 for sale

DISCO DFD 651 is a scribing and dicing machine developed by DISCO Corporation. The equipment is used primarily to produce crystalline substrates such as semiconductor wafers, substrates and thin films. The system's integrated diamond tipped scriber is capable of quickly and precisely cutting a wide range of materials including glass, ceramics, semiconductor layers, and various other laminates. The unit's integrated dicing tables can further separate the cut substrate into individual pieces. DISCO DFD651 is equipped with a patented 3-axis scribing head that is capable of controlling both speed and depth changes in the cutting process. The scribing head can produce a precision cut of up to 0.01mm per pass ensuring a reliable, repeatable product. In addition, the scribing head features adjustable pressure to ensure a consistent quality product. The pick-up and positioning stages of the machine feature a vacuum-gripper to safely secure each piece during the scribing and dicing process. DFD-651 can produce both round and edge-segmented pieces with cuts between 0.2 and 3.2mm in width. The dicing tables of the tool feature a "Loading/Unloading" process which utilizes a shuttle table for safely transferring cut substrates from one station to another. To further ensure a high quality product, the asset can perform a cutting test before processing any substrate. Overall, DFD651 is an effective scribing and dicing model that promises to be a reliable, efficient tool for producing a wide range of crystalline substrates. The combination of its cutting head, dicing tables, and pick-up and positioning stages allow the equipment to precisely and efficiently produce a wide array of substrates with maximum accuracy and minimal stress.