Used DISCO DFD 651 #9408615 for sale
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DISCO DFD 651 is a computer-controlled scribing and dicing equipment used for high-precision cutting and scoring of glass, ceramics, and semiconductors. It features a precision-engineered, X-Y-Z controlled gantry system, enabling highly accurate cutting of intricate shapes on hard materials without edge chipping. The unit includes a dedicated, computer-controlled stage and laser or electronic scribing systems to enable continuous or single-point scribing. The machine includes a vibration-dampened base structure and full compliance anti-tilt tool to ensure stable, accurate machining and low stress on components. It features a smart zooming asset that allows the user to select and easily match the size of the laser beam to the size of the desired cuts without the need for masking or beam expansion. The cutting depth is also adjustable for any given material, making it suitable for a wide range of applications. DISCO DDF651 is compatible with a variety of cutting head configurations, including ablaser, diamond scriber and plunge cutting head. The laser scribing head can be used for precision cutting and for creating groove patterns, while the diamond scriber is used for cutting thick glass and ceramic materials and for scoring applications. The plunge cutting head is suitable for high-speed machining of materials from soft to hard, such as glasses, ceramics and semiconductor wafers. The model also includes a computer-controlled stage and vision equipment, which allows the user to move the material as accurately as required while providing vision and/or laser feedback to ensure accuracy. The system comes with an integrated dust collector, keeping dust particles away from the cutting area and allowing for a cleaner and more efficient operation. The unit features an array of safety features, such as a key card, an emergency stop button and an audiovisual alarm. It is also compliant with international standards, including CE and RoHS. Overall, DISCO DDF651 is a versatile, accurate and safe machine that enables high-precision cutting and scoring of glass, ceramics and semiconductors. It is easy to use and highly suitable for a wide range of industrial and research applications.
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