Used DISCO DFD 651 #9410213 for sale

DISCO DFD 651 is a highly efficient scribing / dicing equipment designed for the high-precision cutting of semiconductor wafers and complex optical components. With its specially designed components, it offers an automated process that ensures consistency and accuracy in the end product. The system takes the form of an automated stage, featuring a X-Y-Z coordinate unit. The machine is fitted with a set of specialized blades that rotate around a vertical cutting axis. This allows it to make accurate cuts in semiconductor wafers and complex optical components alike. The tool head of the machine includes a laser beam that is used to accurately measure the wafers and the cutting parameters such as blade speed, cutting force and blade angle. These can be adjusted to ensure the optimal cutting process for each wafer. The tool itself is highly efficient as it can operate up to a speed of 6,000rpm. It also features a vision asset that deforms to what ever the user desires, from fine-tuning cutting parameters to real-time control. The model is also equipped with a variety of safety measures, such as an overheat prevention equipment, a shock absorber and a dust collector. DISCO DFD651 is a perfect choice for users who need precision and accuracy. The system requires minimal operator training and is able to process complex components with ease. The unit is highly reliable and provides consistent results with its advanced accuracy. With its easy setup and operation, DFD-651 is the perfect tool for anyone who needs to perform accurate and precise cuts on their semiconductor wafers and complex optical components. The quality of its end product is unparalleled and provides the customer with complete assurance.