Used DISCO DFD 651 #9412184 for sale

DISCO DFD 651 is an advanced scribing and dicing machine designed for high-precision dicing operations. The equipment utilizes a high-speed cutting head with ultra-high accuracy to enable the rapid cutting and processing of semiconductor wafers. The system includes a high-resolution 3-axis linear stage to enable multiple layer dicing with a maximum cut speed of 40 mm/s. The unique design of the unit also enables multi-processing, allowing the machine to cut through multiple layers of materials quickly and with minimal downtime. The tool has also been designed to allow for the processing of even the most challenging materials. The asset's cutting head is equipped with various precision cutting tools such as multiple blades, scriber tips, and drill heads. This allows it to be used for various scribing and dicing operations. The cutting head also includes a silicon wafer wafer chucking model to facilitate precise cutting and processing operations. Furthermore, the equipment features a high-precision double-axis, X and Y stages for precise movement of the cutting head for precise and accurate cutting operations. In addition to the advanced cutting head, DISCO DFD651 system also features an advanced optical detection unit to ensure that the position of the wafer is accurately measured prior to the cutting or scribing process. This machine also Includes an advanced vision tool for precision dicing operations. These features ensure the accuracy and consistency of the dicing and scribing operations. Furthermore, the asset is designed for ease of use and safety. The model comes with a user-friendly interface that allows users to input cutting and scribing parameters easily. The equipment also includes an automatic safety lock to prevent unauthorized access. Additionally, DFD-651 includes a feature that automatically detects the size of the wafer and the cutting direction, ensuring the precision and accuracy of the cutting process. Overall, DFD 651 is a powerful scribing and dicing system that has been designed to enable the most precise and accurate cutting operations on semiconductor wafers. The unit's advanced cutting head, X and Y stages, vision machine and safety features all ensure the highest quality operations. The tool also has a user-friendly interface for easy operation and its automated safety locks ensure that unauthorized personnel cannot gain access to the asset.