Used DISCO DFD 6560 #9248511 for sale

DISCO DFD 6560 is a specialized scribing and dicing equipment designed for the slicing of packages of semiconductor wafers used for optoelectronic components like lasers and photodetectors. The system consists of a spindle-driven base, an end-of-arm tool (EOAT) and a suite of tools for performing the scribing, dicing and slicing operations. The base of the unit is composed of an adjustable X-Y platform which is driven by a two-stage DC motor along with a servo-motor and a pulse encoder. The EOAT is composed of an adjustable blade that is driven by the motor and the pulse encoder controller, as well as an optical encoder, a thermocouple probe, and a precision optical laser. DFD 6560 can be used for many different types of scribing, dicing and slicing operations. It has an easy-to-use programmable interface that allows users to customize their slicing jobs for specific types of materials and components. It has a high-speed spindle with a controller that allows for operation at up to 18,000 rpm. It also has a range of safety features that guard against misalignment or overloading of the machine. DISCO DFD 6560 can be used for the cutting of silicon, glass, sapphire or quartz substrates, as well as thin metal films or polishing operations. It is capable of delivering precise, scribe, dice, or slice operations on a wide range of different semiconductor packages with minimal waste. The tool is compatible with both loose and embedded-type chip packages, which makes it ideal for both applications. It also has an auto-feed feature, allowing it to repeat the same operations on multiple packages with high precision and accuracy. Additionally, the asset is highly accurate, being able to operate at a sub-micron level, and it is easily maintained because of its low-maintenance and wear-resistant components. Overall, DFD 6560 is a sophisticated and highly reliable scribing, dicing and slicing model designed to deliver precise results with maximum efficiency and minimal waste. It is compatible with a wide range of materials and components, and it is capable of carrying out a range of complex chip operations with high accuracy and consistency.