Used DISCO DFD 660 #293637849 for sale

DISCO DFD 660 is a high-performance scribing / dicing equipment commonly used for both semiconductor wafer backgrinding and laser micromachining of micro-devices. It is suitable for a range of applications and materials, including semiconductor wafers, crystals, MEMS and discrete components. The system is designed to provide precise and accurate scribing / dicing capabilities and features a high-precision pick and place head that can be used to precisely position samples and materials as well as a scribing / dicing head equipped with a laser unit with high cutting power and speed. The scribing / dicing head is capable of cutting samples with a thickness range of 0.25mm to 2.0mm at a high speed. It uses a CO2 laser machine equipped with a variety of lenses to adjust the beam diameter and depth of cut, and to ensure a high precision of dicing with optimal width of the chip. A motorized XYZ motion transport tool is capable of providing precise and accurate positioning for the scribing / dicing process, allowing for high accuracy and repeatability in the process. The asset includes an automatic wafer-loading model, enabling multiple wafers to be loaded simultaneously. The loading equipment aligns the wafer parallel to the X-Axis and moves it via a precise step motor, making the precise alignment of each wafer a non-issue. The system also includes a vision unit to detect and locate the precise target area for scribing/dicing. The vision machine utilizes a laser beam to detect the precise position of the wafer for the scribing process and the presence of any foreign particles on the wafer, to ensure precise and repeatable results. The tool also features a number of safety features, such as automatic shut-off when the scribe head is out of alignment with the laser, enabling safe operation. The asset also features an emergency stop button, enabling the user to quickly and easily terminate the scribing process should a problem arise. Overall, DISCO DFD660 is a highly capable scribing / dicing model with high precision and speed. It is ideal for a range of applications and materials, is easy to use and provides great repeatability for accurate and fast operation.