Used DISCO DFD 6750 #293610024 for sale

DISCO DFD 6750 is a high precision scribing and dicing equipment designed to handle a variety of materials ranging from semiconductor wafers to glass substrates. It is capable of accurately processing wafers of up to 200mm in diameter. The system is based around a 5-axis displacement stage with a rigid machine frame and two worktables. The unit features a Flex-Drive mechanism in the Y-axis, which is equipped with a hybrid servo motor and gearbox providing high precision and maximum positioning accuracy. The machine also has a Z-axis and a tilt-angle control for depth and angle of cut. The cutting head of DISCO DFD6750 machine utilizes a high-speed diamond scribing tool to produce precise grooves and cuts which makes the tool suitable for microelectronic and optical applications. The asset is also equipped with an automated and intelligent cutting capability allowing it to produce complex shapes and sizes, while maintaining a consistent cut quality and finish. The model can be connected to an external computer and a touch screen, which helps in remote operation. It also comes with a video camera, which can be used to assist with the dicing process, as well as providing visual feedback when needed. DFD 6750 offers a variety of cutting modes including simple cut operations, surface profiling, edge abrasion and beveling. The user-friendly interface allows for easy setup, programming, and operation of the equipment. It also offers a range of safety features and alarm systems to protect against potential wear and tear on the machine components, as well as helping to maintain product quality. Overall, DFD6750 is a reliable and precise scribing and dicing solution that is ideal for a range of applications. Its advanced cutting technology and safety features make it an efficient and cost-effective solution for the production of complex microelectronic and optical components.