Used DISCO DFD 6750 #9394641 for sale

Manufacturer
DISCO
Model
DFD 6750
ID: 9394641
Vintage: 2019
Dicing saw Maximum rotation diameter: 340 mm X-axis: Cutting range: 300 mm Cutting speed: 0.1-1,000 mm/sec Y1.Y2-axis: Cutting range: 300 mm Index step: 0.0001 mm Index positioning accuracy: within 0.003/660 at 1.5 kW, within 0.002/5 at 2.2 kW Z-axis: Maximum stroke: 19.2 mm (For φ 2" blade) at 1.5 kW 19.9 mm (For φ 2" blade) at 2.2 kW Moving resolution: 0.00005 mm Repeatability accuracy: 0.001 mm Θ-axis: Maximum rotating angle: 215° degree Spindle: Rated torque: 0.29 Nm at 1.5 kW, 0.7 Nm at 2.2 kW Revolution range speed: 6,000-60,000 min^-1 at 1.8 kW 3,000-30,000 min^-1 at 2.2 kW 2019 vintage.
DISCO DFD 6750 is a scribing/dicing equipment designed to provide accurate and reliable cutting of substrates such as glass and semiconductor wafers. It has an ergonomic design that allows for easy access of the cutting head and allows for smooth, precise movement. The scribing tool moves along two linear axes for precise cuts that are straight and parallel. The X-Y stage moves smoothly at up to 4 cm/s, and can move in increments of 0.02 mm. The system also has adjustable downforce, up to 500g, allowing for a wide range of materials to be cut. The cutting head in DISCO DFD6750 is equipped with a high-speed, spindle motor. The rotation speed can be adjusted from 100-50,000 rpm to allow for different cutting requirements. The cutters use diamond-tipped blades and are able to cut a range of substrate thicknesses, both with and without a glass substrate. The unit can also be used for laser cutting and can be adapted to use various laser tools. DFD 6750 also has an advanced vacuum machine to ensure accurate and precise cuts. The vacuum aligns and stabilizes the substrate and prevents slippage. The suction force can be adjusted from 0.1 to 13 mbar, allowing for a variety of substrates to be cut. The tool also has an electronic timers and counters to monitor process time and cut count. DFD6750 is an efficient and durable asset for scribing and dicing of a variety of substrates. It is easy to use and has adjustable speeds and downforce, making it suitable for a wide range of substrates. It is also extremely precise and has advanced vacuuming to ensure that all cuts are accurate.
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