Used DISCO DFD 681 #9250208 for sale

DISCO DFD 681 is a scribing and dicing equipment manufactured by DISCO Corporation for use in processing semiconductor wafers. The system is equipped with the latest in ultra-precise positioning technology, allowing for the accurate cutting and dicing of a variety of materials. DISCO DFD681 is a fully automated and non-contact scribing unit, meaning it can be programmed to scribe and dice wafers without manual operation. This is made possible by the advanced positioning techniques and built-in safety protocols that prevent accidental or unnecessary scribing. The machine features a vacuum-based conveyor tool, as well as dual-mode scribing and slicing for greater versatility and speed. The scribing process is generally done in two distinct stages. First, the wafer is placed in the scribing asset's automated handling tool, which positions the wafer in the proper orientation. The model then moves the wafer to the scriber's laser beam, which is used to cut and dice the wafer. The wafer is then processed in a second stage, wherein it is diced into multiple segments for further processing or packaging. DFD 681 is designed to be easy to use and maintain, with a comprehensive graphical user interface (GUI) allowing users to program and monitor the scribing operation. The equipment is also very precise, with a repeatability down to one-hundredth of a micron. This accuracy and ease-of-use make it the perfect solution for any application that requires precision scribing and dicing. DFD681 is a reliable and versatile machine, providing a top-of-the-line solution for precision scribing and dicing. Its advanced positioning and cutting technology, along with its user-friendly GUI, makes it an ideal choice for any scribing and dicing application.