Used DISCO DFD 681 #9272360 for sale

DISCO DFD 681 is a next generation scribing and dicing equipment that provides high-precision chip formation with superior accuracy and repeatability. The system uses an original diamond wire saw technique to cut wafers into virtually any shape with perfect uniformity and smoothness. It also provides a wide variety of cutting capabilities, including plane cutting, linear drilling and tapping, cross-drilling, and much more. DISCO DFD681 is equipped with a 10-axis calibration unit that ensures precise cutting. It features a wide range of control features, such as programmable and adjustable saw tilt angles, variable speed scanning, and a number of feed rate and orientation parameters. It is also equipped with a laser-based sensing machine that allows it to make real-time, in-process measurements and adjustments for optimal precision. The tool is equipped with a heat- and dust-proofed aluminum frame that houses its cutting components. All components are made with highly-resistant materials, and the asset is equipped with a set of safety and security features that protect against potential hazards from the diamond wire saw. It also includes a user-friendly control panel with easy to understand touch-panel operation, and a real-time model performance monitor. The equipment employs a two-stage cutting process. The first stage is an initial rough cutting stage, in which the diamond wire saw cuts out the wafer to a predetermined rough cut. The second stage is a precision cutting stage, in which the diamond wire saw fine-tunes the wafer to a predetermined shape with higher precision. This process is particularly suitable for cutting thin wafers at the highest levels of precision. DFD 681 is a versatile system, providing a range of cutting capabilities with high levels of precision. Its next-generation cutting technology ensures superior accuracy and repeatability, and its user-friendly control panel allows easy set up and operation. This unit is an ideal choice for high-precision scribing and dicing of thin wafers.