Used DISCO DFD 681 #9362734 for sale
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ID: 9362734
Wafer Size: 6"
Vintage: 2001
Dicing saw, 6"
Universal chuck table, 6"
Wheel cover, 4"
Flange, 4"
Spinner table, 6"
Spindle, 4"
Spindle power: 2.2 kW
Revolution: 30000 RPM
Flange with tooling
Microscope camera with micro and macro
Full automation wafer handling
Pressure pump
Automatic alignment system
Non contact setup
(2) Cassette stages for 6" or 8" cassettes
X-Axis
Y-Axis
Theta axis
Power cable: 3m
2001 vintage.
DISCO DFD 681 is a scribing/dicing equipment that uses laser ablation technology to create high-precision parts and components for applications such as medical devices, optoelectronics, and semiconductors. This system was designed to provide the precision and speed of laser processing, while providing the ability to scribe and dice a wide range of materials. DISCO DFD681 unit incorporates a state-of-the-art laser ablation machine, which utilizes UV-excited excimer laser. This laser tool is based on an advanced frequency-doubling KTP crystal, offering a UV laser output of up to 172mJ at a wavelength of 248nm with burst rates of up to 1 kHz. This laser asset offers great flexibility as it can be used to scribe and/or dice materials ranging from polymer films, substrates, and semiconductors. The model also uses an automated focusing head with a 3-axis motion stage. The focusing head offers precise control over the focusing spot size, and the motion stage provides speed and accuracy for high-speed scribing. The focusing head is coupled with a precision-controlled scribing/dicing mechanism, which allows for precise sizing and placement of scribes and dices. DFD 681 also features a closed-loop cooling equipment, which is used to ensure efficient and reliable thermal cooling of the substrate material as well as the tooling and laser head. This dual-zone cooling system helps to prevent burning or machining of material and ensures a quality scribing output. Furthermore, the unit features a precision-controlled substrate movement, which can be used to drive the substrate material over the drilling or scribing/dicing mechanisms. In conclusion, DFD681 is an advanced laser ablation-based scribing/dicing machine that offers high-speed performance as well as precise control over focusing spot size and scribing/dicing parameters. The tool is ideal for applications that require precise, high precision parts and components. Moreover, the asset's automated focusing head, robust cooling model, and precision-controlled substrate movement make it an ideal solution for a wide range of applications.
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