Used DISCO DFD 6860 #9206419 for sale

DISCO DFD 6860 is a high-precision scribing/dicing equipment developed by DISCO Corporation. This system is designed to perform scribing and dicing of a wide range of wafer materials, including silicon, germanium, and quartz. DFD 6860 does this with its advanced rotating diamond saw blade, which is capable of cutting materials of any hardness to within 7.5 μm accuracy. The saw blade can be adjusted in pitch angle, speed, and depth of cut, allowing for easy and precise scribing and dicing of various materials. DISCO DFD 6860 features a unique detection unit which is used to detect the edge of the substrate and adjust the position of the scribe mark automatically. This ensures that the scribe mark is always accurately placed and the material is cut exactly as required. Furthermore, the machine is equipped with a high-precision laser which is used to check the edge of the substrate before cutting. This helps to ensure that the scribe mark is placed accurately and that the desired cut is attained. DFD 6860 is controlled by a touchscreen display, which allows for the easy operation and control of the tool. This means the user can adjust settings and make visual adjustments to the scribing/dicing job, ensuring that only the desired results are attained. The asset also has a self-diagnosis routine which helps to identify any potential issues and helps to ensure optimal performance. DISCO DFD 6860 is an incredibly powerful and reliable machine, ideal for those requiring precision scribing/dicing of a variety of materials. Its robust design, intuitive operating model, and ability to detect the edge of materials make it an ideal choice for those requiring detailed accuracy and performance. This makes it an excellent choice for both industrial and research applications, offering precision, reliability, and performance.